Portable object with chip and antenna

ABSTRACT

The invention concerns a method of manufacturing a module ( 24 ) intended to create a portable object with chip and antenna ( 36 ). The portable object comprises an antenna ( 20, 20   a   , 20   b   , 20   c ) and a chip ( 18 ) placed on an insulating substrate ( 10 ). The antenna ( 20, 20   a,    20   b   , 20   c ) comprises a plurality of turns ( 14 ). The method comprises a first step in which an insulating substrate ( 10 ) with at least one side ( 10 ′) is provided. The method is characterised in that it further comprises a second step in which an individual housing ( 12, 12   a   , 12   b,    12   c ) opening in the said side ( 10 ′) is made for each of the said turns ( 14 ) and a third step in which said antenna ( 20, 20   a   , 20   b   , 20   c ) comprising a plurality of turns ( 14 ) is made by placing a conducting material ( 20   a   , 20   b   , 20   c ) in each individual housing ( 12, 12   a   , 12   b   , 12   c ).

FIELD OF THE INVENTION

[0001] This invention concerns a method of manufacturing a moduleintended to create a portable object with chip and antenna including anantenna and a chip placed on an insulating substrate, a method ofmanufacturing a batch of n modules for portable objects with chip andantenna, a method of creating a portable object with chip and antenna,and a module intended to create a portable object with chip and antenna,and a portable object with chip and antenna.

[0002] Such portable objects may, in particular, be cards or phonecards, but also security labels or tags.

[0003] Such cards with chip and antenna are intended to load or downloadinformation by radio transmission of data between an antenna placed inthe card body and a fixed transmitter/receiver located nearby. Suchlabels are, for example, intended to be affixed to products on sale toprevent theft.

BACKGROUND OF THE INVENTION

[0004] Methods of manufacturing such portable objects, especially cards,are known, for example in document U.S. Pat. No. 6,088,230, in which theantenna, consisting of a conducting wire, is first connected by one endto a contact on a chip placed on a substrate, then placed on thesubstrate with a wire guide and insertion means which are movedbi-axially across the surface of the substrate (along X and Y axes).When the antenna follows a meandering path, connection points arenecessary at each change of direction.

[0005] To make these connection points, the insertion means must belowered along a Z-axis and the conducting wire is temporarily pressedagainst the surface of the substrate and then pressed and thermallywelded in the substrate. Lastly, the second end is connected to anothercontact of the chip, and the substrate and its components can then becovered by a protective layer.

[0006] The steps involved in producing a card with chip and antenna aredifficult, especially when the antenna is not straight.

[0007] In addition, the antenna is not held in place before beingcovered with the protective layer, making it impossible to guarantee itsposition.

[0008] The European patent application published under number EP 0 841634 concerns a method of manufacturing an integrated circuit cardcomprising an antenna comprising at least one turn in which a uniquehousing is made to contain said antenna.

[0009] The U.S. Pat. No. 6,021,949 concerns a gaming token comprising anelectronic identification element and an antenna. The antenna maycomprise a plurality of turns which are placed in a unique housing.

[0010] By placing an antenna comprising a plurality of turns in a uniquehousing there is some disadvantages. During, for example, an injectionstep following a positioning step in which the antenna is placed in theunique housing, the position of the turns can namely vary, thusmodifying the geometry of the antenna. By modifying the geometry of theantenna, there is a risk that the operating frequency of the portableobject can be less precisely defined. So the portable object obtained bysuch a method can be less reliable.

SUMMARY OF THE INVENTION

[0011] One purpose of the invention is to propose a method which enableto obtain a more reliable portable object.

[0012] According to an aspect of the invention, a method ofmanufacturing a module intended to create a portable object with chipand antenna. The portable object comprises an antenna and a chip placedon an insulating substrate. The antenna comprises a plurality of turns.The method comprises a first step in which an insulating substrate withat least one side is provided. The method is characterised in that itfurther comprises:

[0013] a second step in which an individual housing opening in the saidside is made for each of the said turns;

[0014] a third step in which said antenna comprising a plurality ofturns is made by placing a conducting material in each individualhousing.

[0015] By first making a plurality of individual housings and then byplacing each turn of the antenna in a different individual housing, theinsulation between the different turns is better. Furthermore thegeometry of the antenna is more precisely defined. In particular thereis a little risk that the different turns moves during the manufacturingprocess. The cross-section of the turns, their geometric shape, thedistance between them is for example more precisely defined. By thusdefining more precisely the geometry of the antenna, the wavelength andoperating frequency of the portable object can be more precisely definedin a specific range. This range corresponds thus better to that of thefixed ad hoc transmitters/receivers. So the method according to theinvention enables to obtain portable object which are more reliable.

[0016] Advantageously, the individual housing can be produced bymachining or by laser.

[0017] Advantageously, the substrate includes a thermoplastic and thesaid housing can then be made by hot pressing or moulding.

[0018] These modes of realisation of the housing are easy to implementand provide in particular an easy way of making any shape of housing,which means in addition that numerous possibilities are availableconcerning the type of antenna.

[0019] In particular the type of material employed for the antennacontribute to define a precise wavelength and operating frequency in thesame range as that of the fixed ad hoc transmitters/receivers. Generallythe antenna consists of a conducting material, which in this case can bemade from a conducting wire or a conducting paste, depending on thechosen housing.

[0020] The turns forming the antenna may have a circular cross-sectionwhen a conducting wire is used, for example, and may be wound in variousgeometries.

[0021] Advantageously, the said antenna and the said connections arerealised simultaneously.

[0022] The connections between the antenna and the chip can be made bydirect contacts, each end of the antenna then being physically connectedaccording to known techniques to a respective connector on the chip. Theconnections can also be made without contact, in this case the chipincludes an inductor and the antenna includes an induction coil whichinteracts with the chip inductor.

[0023] An other object of this invention is to propose a method ofmanufacturing a batch of n modules for portable objects with chip andantenna each comprising an antenna comprising a plurality of turns and achip placed on an insulating substrate.

[0024] This objective is reached due to the fact that a plate isprovided on which n areas are defined each including an insulatingsubstrate each of which comprises at least one side, that a plurality ofindividual housing opening in each of the said sides is made, saidindividual housings intended to contain separately each turn of anantenna and, that an antenna comprising a plurality of turns is made byplacing a conducting material in each of the said individual housings.

[0025] This method can be used to produce the modules in medium or evenlong series production runs. All the housings can, for example, beproduced in one step, then all the antennas are made, etc. Inparticular, this enables the various steps of the method to be carriedout on different stations.

[0026] An other object of this invention is to improve a method ofcreating a portable object with chip and antenna.

[0027] This objective is achieved due to the fact that said portableobject with chip and antenna is made from a module comprising a chip, anantenna comprising a plurality of turns, a substrate in which aplurality of individual housings is made to individually contain theturns.

[0028] When the substrate includes advantageously a thermoplastic, atleast one layer of thermoplastic can be placed on the said module andthe assembly formed by the said module and the said layer ofthermoplastic can be hot rolled or the said substrate can be placed in amould and a thermoplastic material can be injected in the said mould.

[0029] These two techniques can be used to produce by polymerisationstrong bonds between the thermoplastic substrate and the thermoplasticmaterial added to create the portable object with chip and antenna.Thus, after treatment, the substrate is completely buried in the body ofthe portable object and its physical shape is no longer visible. Therolling or moulding temperatures are low enough to avoid damage to themodule, in particular to the electronic components it includes.

[0030] Advantageously, an additional form forming a cover can also beplaced over the individual housings of the said module to create theportable object with chip and antenna.

[0031] This method is especially useful when using a batch of n modulesas mentioned above and a single additional form is placed over theentire plate to close each housing.

[0032] With the present invention it is still possible to propose amethod for creating simultaneously n portable objects with chip andantenna each including an antenna and a chip. This is possible due tothe fact that the said portable object with chip and antenna is madefrom the batch of n modules obtained according to the above-mentionedmethod.

[0033] Advantageously, the n portable objects with chip and antenna canbe produced using methods similar to those described previously. Inparticular, they can be obtained by moulding or hot rolling, when theplate includes advantageously a thermoplastic or with a cover. Theassembly so formed, including the plate and the modules, is then cutinto n portable objects with chip and antenna.

[0034] An other object of this invention is to improve a module intendedto create a portable object with chip and antenna comprising an antennaand a chip placed on an insulating substrate, said antenna comprising aplurality of turns.

[0035] This object is reached due to the fact that the module comprisesan insulating substrate comprising at least one side, a plurality ofindividual housings opening in said side, that each individual housingcomprises a turn of said antenna, said turn being made of a conductingmaterial.

[0036] These modules form the main part of the body of a portable objectwith chip and antenna in which they are fitted simply, for example,according to one of the previously described methods.

[0037] These modules can be obtained according to any of theabove-mentioned methods. In particular, they can be made individually orin a plate cut afterwards.

[0038] An other object of this invention is to improve a portable objectwith chip and antenna comprising a chip and an antenna.

[0039] This object is reached due to the fact that the portable objectwith chip and antenna comprises a module obtained according to any ofthe previously described methods.

[0040] The invention will be clearly understood and its advantages willappear on reading the detailed description below, of modes ofrealisation represented as non-limiting examples.

BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The description refers to the attached drawings, on which:

[0042]FIG. 1 is a plan view of a substrate,

[0043]FIG. 2 is a plan view of a module including a substrate, anantenna and chip,

[0044]FIGS. 3A and 3C, are cross-sections according to line III-III ofFIG. 2 each illustrating a variant of the module,

[0045]FIG. 4 is a plan view of a plate including several modules,

[0046]FIG. 5 is a cross-section of the module of FIG. 3A placed in amould,

[0047]FIG. 6 is a cross-section of a portable object, in particular acard with chip and antenna,

[0048]FIG. 7 is a cross-section of the module of 3C ready for hotrolling, and

[0049]FIG. 8 is a cross-section of the module on which a cover isplaced.

DETAILED DESCRIPTION

[0050]FIG. 1 shows a substrate 10, preferably of thermoplastic in which,on one of the sides 10′, individual open housings 12 has been producedintended to contain an antenna made from conducting material notrepresented. These housings 12 can be obtained, for example, bymachining, laser or moulding. The substrate 10 may also include ahousing intended to contain a chip.

[0051]FIG. 2 illustrates a module 24 including the substrate 10 on whicha chip 18 has been placed and an antenna 20 which has been placed in theindividual open housings 12.

[0052] The connections between the antenna 20 and the chip 18 may occurby induction when the antenna 20 includes a coil and the chip 18includes an inductor or by direct contacts. FIG. 2 shows the antenna 20which includes a first end 20′ connected to a first contact 18′ on thechip 18 and a second end 20″ connected to a second contact 18″. Sincethe mode of realisation of these connections 18′, 20′, 18″, 20″ bydirect contacts is known, it is not described in this invention.Advantageously, means 22 are used to hold the antenna 20 in the housing12. These means 22 may be adhesive material or a special coating whichis applied in the individual housings to make sure that the antenna 20fitted afterwards is held firmly.

[0053] The antenna 20 may be obtained in several ways. In particular, itmay be formed from a conducting wire 20 a, as shown on FIG. 3A. Theindividual housings 12 thus avoid any short circuiting by contactbetween the various turns 14 of the antenna 20 a. The geometry of theantenna is also more precisely defined. In particular the distancebetween the different turns is more precisely defined. The cross-sectionof the individual housings 12 a is preferably semi-circular.

[0054] The antenna 20 can also be made with a filling conducting resin20 c. FIG. 3C shows an example of an individual housing 12 c in which afilling conducting resin 20 c has been applied. After polymerisation,the conducting resin 20 c forms a solid conducting material similar tothe conducting wire 20 a.

[0055] When the substrate 10 includes a chip 18 and an antenna 20 fittedin individual housings 12, it will be referred to as a module 24. Thismodule 24 is then ready to be used to create a portable object,especially a card with chip and antenna. Preferably, apart from itsthickness, the dimensions of the module 24 are similar to those of thecard with chip and antenna for which it is intended (54×85 mm2 for astandard card).

[0056] When the module 24 is used to form another type of card, forexample SIMM, care must be taken to place the antenna 20 and the chip 18in the detachable area of the card support (approximately 15×25 mm2 forthe standard SIMM cards) which is placed in the device for which it isintended (mobile telephone for example).

[0057] Generally in fact, the module 24 is placed in the useful area ofthe portable object which can be detached from a larger supportintended, for example, to simplify its packaging and protect it beforeuse. For the remainder of the description, we will concentrate on thespecial case of cards with chip and antenna.

[0058] The module 24 can be obtained in two different ways.

[0059] Firstly, the modules 24 can be produced individually, by placinga chip 18 on a substrate 10 in which individual housings 12 has beenmade (by machining, laser, moulding, hot pressing, etc.) and in which anantenna 20 of the above-mentioned type is placed.

[0060] Secondly, a batch 24′ of n modules 24 can be producedsimultaneously on a plate 26 on which areas 28 are defined. In each ofthese areas 28, individual open housings 12 are made according to any ofthe above-mentioned techniques, in which an antenna 20 comprising aplurality of turns and a chip 18 are placed. Each module 24 obtained canthen be cut out giving the same shape as that obtained using theindividual method or the plate 26 including the n modules 24 can beimplemented in its entirety in the form of a batch of n cards with chipand antenna before being cut to the particular format of the card.

[0061] Several methods are available to integrate the module 24 In thebody of a smartcard. These methods are the same when using a plate 26including n modules 24, to produce simultaneously a batch of n cardswith chip and antenna.

[0062] When the module 24 used is a thermoplastic, to produce a cardwith chip and antenna, the module 24 can be placed in the bottom 30 of amould 32 preferably made from two parts 32 a and 32 b, the part 32 asupporting for example the module 24, as shown on FIG. 5. Thermoplasticmaterial can then be injected through an opening 34 provided for thispurpose in the part 32 b. The thermoplastic forming the substrate 10will react with the thermoplastic material added to form strong bonds bypolymerisation. After demoulding, a card with chip and antenna 36 isobtained, as shown on FIG. 6, in which the substrate 10 is no longervisible, since it is completely fused with the added thermoplasticmaterial. The chip 18 and the antenna 20 are completely buried in thebody of the smartcard 36.

[0063] When the module used is a thermoplastic, the card with chip andantenna 36 can also be produced by hot rolling. In this case, as shownon FIG. 7, a thermoplastic sheet 38 is placed over the side 10′ of thesubstrate 10 including the antenna 20 and the chip 18 and the assemblyis hot rolled between known rollers, not shown, so as to form the cardwith chip and antenna 36 in which the substrate 10 is no longer visible.Preferably, two thermoplastic sheets 38 and 40 are used between whichthe module 24 is placed.

[0064]FIG. 8 shows another method of producing cards with chip andantenna. The individual housings are closed by placing on the side 10′of the substrate 10, wholly or partially, an additional form 42 whichhas raised sections 44 formed on one of these sides intended to enterthe individual housings 12 b. The additional form 42 constitutes a cover42 which is held on the side 10′ by adhesive, thermal, mechanical means,etc., not described, so as to form a card with chip and antenna.

[0065] The methods employed to manufacture a card with chip and antenna36 using the above-mentioned methods also apply to the manufacture ofbatches of n cards with chip and antenna 36. In fact, the substrate 10is replaced by the plate 26 including n modules 24 and the same steps asthose described, specific to each method, are applied. Thus, an assemblyis obtained from the plate 26 including a batch of cards with chip andantenna, which is simply cut out to obtain n cards with chip and antenna36.

[0066] As for the substrate 10, when proceeding by moulding or hotrolling, the plate 26 is no longer visible in the assembly of cards withchip and antenna, since it is completely buried in the thermoplasticmaterial added. Although both of these methods can be used with a plate26 including several modules 24, it is preferable to first cut out nmodules 24 and to produce and realise n cards with chip and antenna 36individually. The method with cover 42 is as easy to implement, whetherfor a module 24 or a plate 26 including the batch 24′ of n modules 24.

1. A method of manufacturing a module (24) intended to create a portableobject with chip and antenna (36) comprising an antenna (20, 20 a, 20 b,20 c) and a chip (18) placed on an insulating substrate (10), saidantenna (20, 20 a, 20 b, 20 c) comprising a plurality of turns (14),said method comprising a first step in which an insulating substrate(10) with at least one side (10′) is provided, the method ischaracterised in that it further comprises: a second step in which anindividual housing (12, 12 a, 12 b, 12 c) opening in the said side (10′)is made for each of the said turns (14); a third step in which saidantenna (20, 20 a, 20 b, 20 c) comprising a plurality of turns (14) ismade by placing a conducting material (20 a, 20 b, 20 c) in eachindividual housing (12, 12 a, 12 b, 12 c).
 2. The method according toclaim 1, characterised in that a filling conducting resin (20 c) isapplied in the individual housings (12 a, 12 c) and in that the saidconducting resin (20 c) is polymerised to form the antenna (20 c). 3.The method according to claim 1, characterised in that a conducting wire(20 b) is placed in each individual housing (12, 12 a, 12 b, 12 c) toform the antenna (20 b).
 4. A method of manufacturing a batch of nmodules for portable objects with chip and antenna (36) each comprising:an antenna (20, 20 a, 20 b, 20 c) comprising a plurality of turns (14);and a chip (18) placed on an insulating substrate (10), characterised inthat a plate (26) is provided on which n areas (28) are defined eachincluding an insulating substrate (10) each of which comprises at leastone side (10′), in that a plurality of individual housing (12, 12 a, 12b, 12 c) opening in each of the said sides (10′) is made, saidindividual housings (12, 12 a, 12 b, 12 c) being intended to containseparately each turn (14) of an antenna (20, 20 a, 20 b, 20 c); and inthat an antenna (20, 20 a, 20 b, 20 c) comprising a plurality of turns(14) is made by placing a conducting material (20 a, 20 b, 20 c) in eachof the said individual housings (12, 12 a, 12 b, 12 c).
 5. A method ofcreating a portable object with chip and antenna (36) characterised inthat said portable object with chip and antenna (36) is made from amodule (24) comprising a chip (18), an antenna comprising a plurality ofturns (14), a substrate (10) in which a plurality of individual housings(12, 12 a, 12 b, 12 c) is made to individually contain the turns (14).6. The method according to claim 5 characterised in that the substratecomprises a thermoplastic, in that at least one layer (38,40) ofthermoplastic is placed on said module (24) and in that the assemblyformed by said module (24) and said layer (38, 40) of thermoplastic ishot rolled.
 7. The method according to claim 5, characterised in that anadditional form (42) forming a cover is placed over the individualhousings (12, 12 a, 12 b, 12 c) of the said module (24).
 8. The methodaccording to claim 5, characterised in that said substrate (10)comprises a thermoplastic, in that said substrate (10) is placed in amould (32) and in that a thermoplastic material is injected in saidmould (32).
 9. A module (24) intended to create a portable object withchip and antenna (36) comprising an antenna (20, 20 a, 20 b, 20 c) and achip (18) placed on an insulating substrate (10), said antennacomprising a plurality of turns (14), the module (24) is characterisedin that it comprises: an insulating substrate (10) comprising at leastone side (10′); a plurality of individual housings (12, 12 a, 12 b, 12c) opening in said side (10′); and in that each individual housing (12,12 a, 12 b, 12 c) comprises a turn (14) of said antenna (20, 20 a, 20 b,20 c), said turn (14) being made of a conducting material (20 a, 20 b,20 c).
 10. Portable object with chip and antenna (36) comprising a chip(18) and an antenna (20, 20 a, 20 b, 20 c), the portable object ischaracterised in that it comprises a module (24) obtained according toclaim 8.